MSE-411-nandita-2026-06-02-11-35-33
Below is a syllabus template that includes WSU's required syllabus elements. Please complete all items highlighted in yellow.
Title of Course : Semiconductor Processing and Fabrication
Prefix and Number MSE 411
Semester and Year: Fall 2027
Number of Credit Hours: 3
Prerequisites/co-requisites: MSE 302 or instructor’s permission
Course Details
Day and Time: 2 hour lecture and 1 hour lab
Meeting Location: [tbd]
Instructor Contact Information
Instructor Name: [tbd]
Instructor Contact Information: [office location, phone, email] [tbd]
Instructor Office Hours: [click here for best practices] [tbd]
TA Name: [tbd]
TA Contact Information: [office location, phone, email]: [tbd]
TA Office Hours: [click here for best practices] [tbd]
Course Description
Introduction of semiconductors and semiconductor fabrication process. Include Oxidation, diffusion, photolithography, Plasma and Acid etching, thin film deposition, Device fabrication.
Course Materials
Text Books:
Fundamentals of Semiconductor Processing Technologies, Badih El-Kareh, Kluwer Academic Publishers.
Required and/ or recommended materials
- Introduction to Microfabrication”, Franssila, Sami. Available through WSU libraries.
- Honsberg, C., and S. Bowden. Photovoltaics: Devices, Systems and Applications CD-ROM. [A free online resource.]
- The Science and Engineering of Microelectronic Fabrication, 2nd
Edition, Campbell, S.A. , Oxford University Press.
- Fundamentals of Microfabrication, 2nd Edition, Madoum M. , CRC Press
Other Materials: N/A
Fees: N/A
|
Course Learning Outcomes (students will be able to:) |
Activities Supporting the Learning Outcomes | Assessment of the Learning Outcomes |
|---|---|---|
| Demonstrate knowledge of nanofabrication fabrication processes | Homework, Quizzes and Exams | Homework, Quizzes and Exams |
| Demonstrate knowledge of photovoltaic cells | Homework, Quizzes and Exams | Homework, Quizzes and Exams |
|
Demonstrate knowledge role of dopants in electrical properties of materials |
[Homework, Quizzes and Exams |
Homework, Quizzes and Exams |
|
Demonstrate calculation of dopant diffusion |
Homework, Quizzes and Exams |
Homework, Quizzes and Exams |
|
Demonstrate knowledge of the principles of operation of a p-n junction |
Homework, Quizzes and Exams |
Homework, Quizzes and Exams |
|
Demonstrate basic knowledge of the processing steps in modern semiconductor fabrication techniques |
Homework, Quizzes and Exams |
Homework, Quizzes and Exams |
| Dates | Lesson Topic | Assignment | Assessment |
|---|---|---|---|
|
Week 1 |
Admin/expectations/overview, introduction to micro-fab, cleanrooms (safety and RCA clean)-lab, Introduction of Crystal growth, Semiconductor materials (elemental, compound) |
Team formed for project, Cleanroom safety orientation completed, HW #1 assigned | HW 1 |
| Week 2 Aug 25 |
Oxidation and Nitridation SiO2 and SiO2-Si interface, Thermal oxidation, Silicon nitride. |
Literature review and project topic submission, In-class participation activities | Project Topic |
| Week 3 Sep 1 |
DC/RF deposition PVD deposition – thermal, e-beam, PLD |
Preliminary process flow development, HW #1 due | HW 1 |
| Week 4 Sep 8 |
Chemical vapor deposition, Spin coat, Optical lithography |
Photolithography process plan submission, HW #2 assigned | HW 2 |
| Week 5 Sep 15 |
Chemical vapor deposition: MOCVD, MBE |
Quiz #1, Project progress discussion | Quiz 1 |
| Week 6 Sep 22 |
Lithography: optical lithography, Photomask, Photoresist, Dimensional control and alignment. | Mask design and fabrication workflow submission, HW #2 due | Design submission, HW 2 |
| Week 7 Sep 29 |
X-ray, electron, Ion beam lithography RTP diffusion, wafer clean process |
Mid-project technical progress review | Process Integration Review |
| Week 8 Oct 6 |
Wet etch process, Photolithography, Dry Etching-1 | Etching process documentation submitted, HW #3 assigned | HW 3 |
| Week 9 Oct 13 |
Dry Etching-2, Backside metallization- thin film deposit, Software exposure | Quiz #2, Process integration update, Midterm exam. | Midterm Exam |
| Week 10 Oct 20 |
Device (PN, CMOS, MEMS), Back silicide Al Ion implantation |
Device fabrication process report submitted, HW #4 assigned | HW 4 |
| Week 11 Oct 27 |
Ion implantation, crystal damage and dopant activity | Diffusion and implantation analysis completed | Device Fabrication Review |
| Week 12 Nov 3 |
Diffusion: Diffusion from constant source and continuous source. | HW #5 assigned, Final process integration plan submitted | HW 5 |
| Week 13 Nov 10 |
Metrology and Characterization | Preliminary characterization results presented | The characterization review |
| Week 14 Nov 17 |
Analytical Characterization (AFM, SEM and TEM) | Quiz #3, Final characterization analysis submitted | Quiz |
| Week 15 Nov 24 |
Thanksgiving Break | Thanksgiving Break | |
|
Week 16 Dec 1 |
Final Week | Final exam | Final Exam |
Expectations for Student Effort
For each hour of lecture equivalent, students should expect to have a minimum of two hours of work outside of class.
Grading [add more lines if necessary]
| Type of Assignment (tests, papers, etc) | Points | Percent of Overall Grade |
|---|---|---|
| HW | 50 | 11.11 |
| Labs | 140 | 31,11 |
| Quiz | 60 | 13.33 |
| Exams | 200 | 44.44 |
| Total | 450 | 100 |
| Grade | Percent | Grade | Percent |
|---|---|---|---|
| A |
90-100 |
C | 70-75.9 |
| A- | 88-89.9 | C- | 66-69.9 |
| B+ | 86-87.9 | D+ | 63-65.9 |
| B | 80-85.9 | D | 60-62.9 |
| B- | 78-79.9 | F | 59.9 and below |
| C+ | 76-77.9 |
[Provide information about how grades will be rounded (eg, if 89% earns a B+ and 90% earns an A-, what grade is given to a student with an 89.5?]
Attendance and Make-Up Policy
Students are expected to attend all classes unless otherwise approved by WSU policy. Some of the lecture material is not contained in the text, therefore it is in your best interests to attend. The text is more detailed on some subjects than I will expect you to know, so attending class will let you see which parts are emphasized. If you miss class, you are expected to get the notes from a classmate, not from the professor or TA.
Academic Integrity Statement
“You are responsible for reading WSU’s Academic Integrity Policy, which is based on Washington State law. If you cheat in your work in this class you will:
- Fail the course
- Be reported to the Center for Community Standards.
- Have the right to appeal my decision.
- Not be able to drop the course or withdraw from the course until the appeals process is finished.
If you have any questions about what you can and cannot do in this course, ask me.
If you want to ask for a change in my decision about academic integrity, use the form at the Center for Community Standards website. You must submit this request within 21 calendar days of the decision.”
University syllabus statement
Students are responsible for reading and understanding all university-wide policies and resources pertaining to all courses (for instance: accommodations, care resources, policies on discrimination or harassment), which can be found in the university syllabus.
Use of AI policies:
Students may use AI tools to support their work; however, they are responsible for verifying the accuracy and reliability of any AI-generated information. All original references must be properly cited in Chicago style, and a PDF copy of each source must be uploaded along with the submission. Slides must be prepared using the course template provided by the instructor. The template may not be uploaded to any AI tools, and students are required to create their PowerPoint presentations independently. Submissions that violate AI policies will automatically receive zero grade.
This course content is offered under a Public Domain license. Content in this course can be considered under this license unless otherwise noted.